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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
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Year : 1990 Volume number : 13 Issue: 04 |
Characteristics Of Heat Transfer In Small Disk Enclosures At High Rotation Speeds
(Article)
Subject:
Characteristics
,
Heat Transfer
,
Enclosure
,
Rotation
Author:
Isamu
Sato
Koji
Otani
Makoto
Mizukami
page:
1006
-
1011
A Review Of Thermal Enhancement Techniques For Electronic Systems
(Article)
Subject:
Electronic Systems
,
Review
,
Enhancement
,
Thermal Performance
Author:
L. S
Fletcher
page:
1012
-
1021
High Performance Air Cooled Heat Sinks For Integrated Circuits
(Article)
Subject:
High Performance
,
Air Cooling
,
Heat Sink
,
Integrated Circuits (Ics)
Author:
Dennis J.
Herrell
Claude
Hilbert
page:
1022
-
1031
Boiling Incipience And Nucleate Boiling Heat Transfer Of Highly Wetting Dielectric Fluids From Electronic Materials
(Article)
Subject:
Boiling
,
Nucleate Boiling
,
Heat Transfer
,
Electronic Materials
Author:
S. M
You
Avram
Bar-Cohen
T. W
Simon
page:
1032
-
1039
On The Accommodation Of Coolant Flow Paths In High Density Packaging
(Article)
Subject:
Coolant
,
High Density
,
Packaging
,
Coolant Flow Paths
Author:
Wataru
Nakayama
page:
1040
-
1049
Measured Capacitance Coefficients Of Multiconductor Microstrip Lines With Small Dimensions
(Article)
Subject:
Capacitance Measurement
,
Microstrip Line
,
Multiconductor
,
Small Dimensions
Author:
Mou-Shiung
Lin
page:
1050
-
1054
Laser Drilling Of Microvias In Epoxy-Glass Printed Circuit Boards
(Article)
Subject:
Epoxy-Glass
,
Microvia
,
Printed Circuit Board
,
Laser Drilling
Author:
Ami
Kestenbaum
J.F.
D'Amico
Brent J.
Blumenstock
M.A.
Deangelo
page:
1055
-
1062
Electrical Conduction Through Cu2s Corrosion Films On Copper Contacts
(Article)
Subject:
Electrical Conduction
,
Cu2s
,
Corrosion Films
,
Copper Contacts
Author:
N. Ben
Jemaa
Dan
Simon
D. L
Travers
page:
1063
-
1067
Experimental Study Of The Conducting Spots In Aluminum Contact Interfaces
(Article)
Subject:
Electrical Contact
,
Aluminum
,
Aging
,
Contact Spot
Author:
Magne
Runde
Elin
Hodne
Bard
Totdal
page:
1068
-
1073
Coupled Noise And Its Effects On Modern Packaging Technology
(Article)
Subject:
Noise
,
Packaging
,
Three-Dimensional
,
Low-Noise Packaging
Author:
Samuel H.
Russ
Cecil O.
Alford
page:
1074
-
1082
Packaging Technology For A Low Temperature Astrometric Sensor Array
(Article)
Subject:
Packing
,
Low Temperature
,
Astrometric
,
Sensor Array
Author:
R. Wayne
Johnson
Richard C.
Jaeger
page:
1083
-
1089
Corrosion Criteria For Electronic Packaging. I-A Framework For Corrosion Of Integrated Circuits
(Article)
Subject:
Corrosion Criteria
,
Electronic Packaging
,
Framework
,
Integrated Circuits
Author:
Carl E.
Hoge
page:
1090
-
1097
Corrosion Criteria For Electronic Packaging. Ii. Calculated Corrosion Currents And Acceleration Factors
(Article)
Subject:
Electronic Packaging
,
Corrosion Current Density
,
Acceleration Factor
,
Corrosion Criteria
Author:
Carl E.
Hoge
page:
1098
-
1104
Corrosion Criteria For Electronic Packaging: Iii- Corrosion By Package Family
(Article)
Subject:
Corrosion Criteria
,
Electronic Packaging
,
Package Family
,
Aluminum
Author:
Carl E.
Hoge
page:
1105
-
1109
Spurious Effects Induced By Current Switching In Power Strips Of Wafer Package
(Article)
Subject:
Spurious Effects
,
Current Switching
,
Power Strips
,
Wafer Package
Author:
J.
Chilo
P.
Fort
page:
1110
-
1114
Low Dielectric Material For Multilayer Printed Wiring Boards
(Article)
Subject:
Low-Dielectrics
,
Multilayer
,
Printed Circuit Board
,
Wiring
Author:
A
Takahashi
Akira
Nagai
page:
1115
-
1120
On Microstrip Capacitance And Impedance
(Article)
Subject:
Microstrip
,
Capacitance
,
Impedance
,
Mathematical Models
Author:
Arthur. T
Murphy
Frederick J
Young
page:
1121
-
1123
High Field Capacitance-Temperature Behavior Of Batio3 Ceramic Disc Capacitors
(Article)
Subject:
High Field
,
Ceramics
,
Capacitance-Temperature
,
Ceramic Disc Capacitors
Author:
Colin K.
Campbell
Jacobus Daniel
Van Wyk
page:
1124
-
1127
Void Free Bonding Of Large Silicon Dice Using Gold-Tin Alloys
(Article)
Subject:
Silicon
,
Bonding
,
Bond Degradation
,
Significant Effects
Author:
Chen Y.
Wang
Chin C.
Lee
page:
1128
-
1134
Thermal Stresses In Multilayer Ceramic Capacitors: Numerical Simulations
(Article)
Subject:
Thermal Stresses
,
Multilayer Cermic Capacitor
,
Numerical Simulations
,
Geometry
Author:
Geoffrey C.
Scott
Greg
Astfalk
page:
1135
-
1145
A New Index S For Evaluating Solder Joint Thermal Fatigue Strength
(Article)
Subject:
Evaluating
,
Solder Joint Reliability
,
Fatigue Strength
,
Thermal
Author:
Akio
Yasukawa
page:
1146
-
1153
A New High Temperature Multilayer Capacitor With Acrylate Dielectrics
(Article)
Subject:
High Temperature
,
Multilayer
,
Capacitors And Dielectrics
,
Acrylate
Author:
D. G
Shaw
Gary L.
Powers
Angelo
Yializis
page:
611
-
616
Optical And Electrical Investigation Of Ion Bombarded Gaas
(Article)
Subject:
Optical
,
Gaas
,
Ion Bombardment
,
Investigation
Author:
Sidhartha
Sen
Ashok
Vaseashta
page:
617
-
622
Field-Induced Instabilities In Polyimide Passivated Lateral P-N-P Transistors
(Article)
Subject:
Instabilities
,
Polyimide
,
Field-Induced Instabilities
,
P-N-P Transistors
Author:
Terence B.
Hook
Badih
El-Kareh
page:
623
-
628
Damage In Silicon Caused By Magnetron Ion Etching And Its Recovery Effect
(Article)
Subject:
Etching
,
Damage In Silicon Caused
,
Magnetron Ion Etching
,
Recovery Effect
Author:
Hiroaki
Iwakuro
Minoru
Hirai
page:
629
-
632
Prototype Packages In Aluminum Nitride For High Performance Electronic Systems
(Article)
Subject:
Prototype
,
Aluminum Nitride
,
High Performance
,
Electronic Systems
Author:
John A.
Sparrow
Kevin J.
Lodge
page:
633
-
638
Low Temperature Co-Fired Glass Ceramic High Density Interconnect Substrate With Improved Thermal Management
(Article)
Subject:
Thermal Management
,
Substrate Degradation
,
Low Temperature
,
Glass Ceramics
Author:
Angela J.
Martin
Edward L.
Rich, Iii
page:
639
-
646
Preparation, Structure, And Fracture Modes Of Pb-Sn And Pb-In Terminated Flip-Chips Attached To Gold Capped Microsockets
(Article)
Subject:
Preparation
,
Structure
,
Fracture
,
Flip-Chip
Author:
Karl J.
Puttlitz
page:
647
-
655
Flip-Chip Soldering To Bare Copper Circuits
(Article)
Subject:
Flip-Chip
,
Soldering
,
Bare
,
Copper Circuits
Author:
Anthony P.
Ingraham
Jack M.
Mccreary
page:
656
-
660
Strength And Reliability Of Ceramic Modules Soldered To Flexible Cables
(Article)
Subject:
Strength
,
Reliability
,
Ceramic Modules Soldered
,
Flexible Cables
Author:
Nicholas T.
Panousis
James F.
Prosser
page:
661
-
666
Development Of Copper Wire Bonding Application Technology
(Article)
Subject:
Copper Wire
,
Bonding
,
Oscillation
,
Conventional
Author:
Kazuya
Fujita
Takamichi
Maeda
page:
667
-
672
A Comparison Of Copper And Gold Wire Bonding On Integrated Circuit Devices
(Article)
Subject:
Copper Wire
,
Integrated Circuit
,
Gold Wire
,
Comparison
Author:
David P.
Galloway
David J.
Burkhard
Salim L.
Khoury
page:
673
-
681
A New Technique For Testing Tab Bonded Lsis In The Gigahertz Frequency Range
(Article)
Subject:
Testing Tab Bonded Lsi'S
,
Lsi
,
Gigahertz Frequency Range
,
Tab Bonded
Author:
Shin-Ichi
Sasaki
Taichi
Kon
page:
682
-
684
New Method Of Water Cleaning For Circuit Substrate
(Article)
Subject:
Rosin Flux
,
Rosin Solvent
,
Water Cleaning
,
Circuit Substrate
Author:
Nao
Takayama
Tomiji
Sugiyama
Kazuhiko
Takahashi
page:
685
-
692
Terpene Cleaning Of Electronic Assemblies
(Article)
Subject:
Terpenes
,
Cleaning
,
Electronics
,
Assembling The Technology
Author:
Gregory P.
Tashjian
George M.
Wenger
page:
693
-
697
Area Distributed Soldering Of Flexible And Rigid Printed Circuit Boards
(Article)
Subject:
Flexible Printed Circuit
,
Printed Circuit Board
,
Area Distributed Soldering
,
Soldering Of Rigid
Author:
W.
Pelosi
W.A.
Clark
page:
698
-
703
The Association Of Component Solderability Testing With Board Level Soldering Performance
(Article)
Subject:
Component Tests
,
Predict Performance
,
Conclusion
,
Recommendation System
Author:
Mark A.
Kwoka
Paul D.
Mullenix
page:
704
-
712
Materials/Processing Approaches To Phase Stabilization Of Thermally Conductive Pastes
(Article)
Subject:
Thermally Conductive Pastes
,
Stabilization
,
Materials/Processing Approaches
,
Phase Stabilization
Author:
Herbert R.
Anderson, Jr
Richard B.
Booth
page:
713
-
717
Microstructural Evolution During Thermomechanical Fatigue Of 62sn-36pb-2ag And 60sn-40pb Solder Joints
(Article)
Subject:
Microstructural Evolution
,
Thermomechanical Fatigue
,
Solder Joint Reliability
,
Joints
Author:
D.R.
Frear
page:
718
-
726
Creep Fatigue Modeling For Solder Joint Reliability Predictions Including The Microstructural Evolution Of The Solder
(Article)
Subject:
Creep Fatigue Failure.
,
Solder Joint Reliability
,
Predictions
,
Microstructural Evolution
Author:
Harold J.
Frost
Robert T.
Howard
page:
727
-
735
Mechanical Characteristics Of 96.5 Sn/3.5 Ag Solder In Microbonding
(Article)
Subject:
Mechanical Characterization
,
Soldering
,
Microbonding
,
Solder In Microbonding
Author:
Ryoohei
Satoh
Masahide
Harada
page:
736
-
742
Temperature Dependence Of Thermal Expansion Of Ceramics And Metals For Electronic Packages
(Article)
Subject:
Temperature Dependence
,
Thermal Expansion
,
Ceramics
,
Electronic Packaging
Author:
Rajen
Chanchani
Peter M.
Hall
page:
743
-
750
Large Scale Multilayer Glass-Ceramic Substrate For Supercomputer
(Article)
Subject:
Large Scale
,
Multilayer
,
Glass Ceramics
,
Supercomputer
Author:
Yuzo
Shimada
Keiichiro
Kata
Hideo
Takamizawa
page:
751
-
758
High Performance Screen Printable Silicone As Selective Hybrid Ic Encapsulant
(Article)
Subject:
High Performance
,
Screen Printing
,
Hybrid
,
Encapsulant
Author:
C. P.
Wong
page:
759
-
765
Effects Of Polymer/Metal Interaction In Thin-Film Multichip Module Applications
(Article)
Subject:
Polymer
,
Multichip Module
,
Interaction Analysis
,
Thin-Film Devices
Author:
Lwona
Turlik
Lih-Tyng
Hwang
Glenn A.
Rinne
page:
766
-
774
New Screen Printable Polyimide For Ic Devices
(Article)
Subject:
Screen Printing
,
Polyimide
,
Ic Devices
,
Polyimide Particles
Author:
Kenji
Suzuki
Tohru
Kikuchi
page:
775
-
779
Self-Aligned Flip-Chip Assembly Of Protonic Devices With Electrical And Optical Connections
(Article)
Subject:
Self-Aligned
,
Flip-Chip
,
Electrical And Optical Properties
,
Photonic Devices
Author:
Michael J.
Wale
Colin
Edge
page:
780
-
786
Esd Packaging Requirements For An Opto-Electronic Receiver Module
(Article)
Subject:
Esd
,
Opto-Electronic
,
Receiver Module
,
Packaging
Author:
Eric M.
Foster
Richard J.
Wolff
page:
787
-
790
Single-Mode Fiber Packaging For Semiconductor Optical Devices
(Article)
Subject:
Single-Mode Optical Fiber
,
Semiconductor Devices
,
Optical Devices
,
Assembly
Author:
James W.
Mann
Leslie A.
Reith
page:
791
-
797
Optical Components-The New Challenge In Packaging
(Article)
Subject:
Optical Components
,
Challenge
,
Packaging
,
Optical Communication
Author:
Brian M.
Macdonald
Michael R.
Matthews
Keith R.
Preston
page:
798
-
806
The Two Fiber Mechanical Splice Of Low Loss For Optical Fiber Cable
(Article)
Subject:
Mechanical Splice
,
Optical Fiber
,
Cable
,
Fiber
Author:
M
Miyazaki
Morinobu
Mizutani
page:
807
-
810
Low-Loss Fusion Splicing Of Erbium-Doped Optical Fibers For High Performance Fiber Amplifiers
(Article)
Subject:
Optical Fibers
,
High Performance
,
Low-Loss Fusion Splicing
,
Fiber Amplifiers
Author:
Mahendra P.
Singh
James O.
Reese
T. Michael
Wei
page:
811
-
813
3-D Interconnection For Ultra-Dense Multichip Modules
(Article)
Subject:
Multichip Modules
,
3-D Interconnection
,
Ultra-Dense
,
Gold Wire
Author:
Therry
Lemoine
Christian
Val
page:
814
-
821
Automatic Testing Of Metallized Ceramic-Polyimide (Mcp) Substrates
(Article)
Subject:
Automatic Testing
,
Substrate
,
Metallized Ceramic-Polyimide (Mcp)
Author:
Jerzy
Zalesinski
Martin
Mancini
Steven
Defoster
page:
822
-
827
Gaas Multichip Module For A Parallel Processing System
(Article)
Subject:
Gaas
,
Multichip Module
,
Parallel Processing
Author:
Susumu
Kimijima
Toshio
Sudo
Kenji
Itoh
Takeshi
Miyagi
page:
828
-
832
Computation Of Transients In Lossy Vlsi Packaging Interconnections
(Article)
Subject:
Computation
,
Transients
,
Vlsi
,
Packaging
Author:
J. C
Liao
John L.
Prince
page:
833
-
839
Analysis And Simulation Of Multiconductor Transmission Lines For High-Speed Interconnect And Package Design
(Article)
Subject:
Waveform Analysis
,
Simulation
,
High-Speed Interconnect
,
Package Modeling
Author:
Mani
Soma
Hong
You
page:
839
-
846
The Impact Of Packaging On The Reliability Of Flip-Chip Solder Bonded Devices
(Article)
Subject:
Impact Analysis
,
Flip-Chip
,
Solder Bonded Devices
,
Predicted Field Lifetimes
Author:
Kevin J.
Lodge
David J.
Pedder
page:
847
-
855
Investigations Of Failure Mechanisms Of Tab-Bonded Chips During Thermal Aging
(Article)
Subject:
Failure Mechanism
,
Tab Bonded
,
Thermal
,
Aging
Author:
Elke
Zakel
Herbert
Reichl
page:
856
-
864
A New Power Cycling Technique For Accelerated Reliability Evaluation Of Plated Through Holes And Interconnects In Pcb'S
(Article)
Subject:
Reliability Evaluation
,
Interconnects
,
Pcb
,
Pth Powering
Author:
Ramachandra
Munikoti
Pulak
Dhar
page:
865
-
872
Mechanism Of Electromigration In Ceramic Packages Induced By Chip-Coating Polyimide
(Article)
Subject:
Mechanism
,
Electromigration
,
Ceramic Packages
,
Polyimide
Author:
Youji
Mashiko
Masanobu
Kohara
page:
873
-
878
Relation Between Delamination And Temperature Cycling Induced Failures In Plastic Packaged Devices
(Article)
Subject:
Delamination
,
Temperature Cycling
,
Failure
,
Plastic-Packaged
Author:
Karel
Van Doorselaer
Kees
De Zeeuw
page:
879
-
882
Silicone Die Bond Adhesive And Clean In-Line Cure For Copper Lead Frame
(Article)
Subject:
Die Bond
,
Adhesive
,
Cure
,
Copper
Author:
Kazunari
Suzuki
Tomoko
Higashino
page:
883
-
887
In Situ Calibration Of Stress Chips
(Article)
Subject:
In Situ
,
Calibration
,
Stress
,
Chip Design
Author:
Adel F.
Bastawros
Arkady S.
Voloshin
page:
888
-
892
Mechanical Engineering Issues And Electronic Equipment Reliability: Incurred Costs Without Compensating Benefits
(Article)
Subject:
Mechanical Engineering
,
Electronic Equipment Reliability
,
Compensation System
,
Benefit Cost
Author:
Charles T.
Leonard
page:
895
-
902
The Use Environments Of Electronic Assemblies And Their Impact On Surface Mount Solder Attachment Reliability
(Article)
Subject:
Surface Mount Technology
,
Attachment
,
Reliability
,
Solder Reliability
Author:
Werner
Engelmaier
page:
903
-
908
Effect Of Temperature On Isothermal Fatigue Of Solders
(Article)
Subject:
Effect Of Temperature
,
Isothermal Model
,
Fatigue
,
Soldering
Author:
S.
Vaynman
page:
909
-
913
Creep Strains In An Elongated Bond Layer
(Article)
Subject:
Creep
,
Strains
,
Elongation
,
Bond
Author:
Sheera
Knecht
page:
914
-
928
Shear Deformation Of Indium Solder Joints
(Article)
Subject:
Shear Deformation
,
Indium
,
Solder Joint Reliability
Author:
Robert
Darveaux
Lwona
Turlik
page:
929
-
939
Thermally Induced Ic Package Cracking
(Article)
Subject:
Thermally Induced Separation
,
Ic Packages
,
Cracking
,
Pin
Author:
David
Suhl
page:
940
-
945
Silicon Interconnect-A Critical Factor In Device Thermal Management
(Article)
Subject:
Silicon Interconnect
,
Critical Factor
,
Device Thermal Management
,
Device Packaging
Author:
Kevin
Smith
Sorin
Witzman
George
Metelski
page:
946
-
952
Monte Carlo Thermal Optimization Of Populated Printed Circuit Board
(Article)
Subject:
Monte Carlo
,
Thermal Optimization
,
Printed Circuit Board
Author:
T
Elperin
Avram
Bar-Cohen
Rami
Eliasi
page:
953
-
960
Transient Thermal Strain Measurements In Electronic Packages
(Article)
Subject:
Transient Thermal Modelling
,
Strain Measurements
,
Electronic Packaging
Author:
Adel F.
Bastawros
Arkady S.
Voloshin
page:
961
-
966
Effect Of Cooling Mechanism And Powering Configurations On Thermal Impedances In An Electronic Enclosure
(Article)
Subject:
Effect Of Cooling
,
Mechanism
,
Configuration
,
Impedance
Author:
Vincent P.
Manno
K
Azar
Gary
Leisk
page:
967
-
974
Thermal Characteristics Of Single And Multilayer High Performance Pqfp Packages
(Article)
Subject:
Thermal Characteristics
,
High Performance
,
Multilayer
Author:
Debendra
Mallik
Mostafa
Aghazadeh
page:
975
-
979
Transient Thermal Study Of Semiconductor Devices\
(Article)
Subject:
Transient Thermal Modelling
,
Semiconductor Devices
,
Software Development
,
Three-Dimensional Transient Inversion
Author:
Chin C.
Lee
Arthur L.
Palisoc
Y. Jay
Min
page:
980
-
988
Thermal Characteristics Of Tab For Small Systems
(Article)
Subject:
Thermal Characteristics
,
Tab
,
Tab For Small Systems
,
Orientation
Author:
Lawrence
Buller
Barbara
Mcnelis
page:
989
-
997
Substrate Impact On The Thermal Performance Of Tape Automated Bonding Components
(Article)
Subject:
Substrate
,
Impact
,
Thermal Performance
,
Tape Automated Bonding Components
Author:
Tracy L.
Davis
page:
998
-
1005
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